Design Work

Thermal and hardware design.

Selected Work

Direct-to-chip cooling concept built in Siemens NX around a copper pedestal, dense micro-fin field, and transparent manifold.

Simcenter thermal study evaluating serpentine-slot isolation under applied heat load.

Multiphysics model used to estimate magnesium evaporation under plasma exposure when direct measurement is limited.

Low-signature hover configuration study exploring lift strategy, stability, and transition behavior prior to CAD development.

Active builds and engineering studies currently being refined, validated, and prepared for publication.